Arteris launches FlexGen Multi-Die for AI chiplets

Arteris has launched FlexGen Multi-Die, a non-coherent interconnect designed for AI and high-performance computing chiplet architectures, supporting bidirectional transactions over a UCIe PHY and reducing PHY area, power, and I/O requirements by up to 50%. This product aims to help chip designers move from monolithic to multi-die designs by enabling scalable, efficient chiplet integration and maintaining system intelligence across multiple dies.

This Wire brief sits within Fusion42's coverage of Semiconductors.