HBM Shipments to Malaysia Surge, Pointing to Intel's "Project Pelican" Facility

High-bandwidth memory (HBM) shipments to Malaysia have surged, suggesting Intel's Project Pelican advanced packaging facility is ramping up to handle increased demand and diverting some HBM volume from TSMC in Taiwan. The facility, supporting Intel's EMIB and Foveros packaging, is also expanding capacity to meet growing AI accelerator customer orders.

This Wire brief sits within Fusion42's coverage of Semiconductors.