China makes progress in 3-nm chips without advanced lithography tools

Chinese researchers at the Academy of Sciences have made progress developing sub-3-nm semiconductor chips using older deep ultraviolet lithography tools due to US export restrictions blocking advanced EUV technology. This early-stage breakthrough relies on gate-all-around transistor architecture but remains far from mass production viability.

This Wire brief sits within Fusion42's coverage of Semiconductors, and 2 sources have reported it.