ASMPT sales jump 49% on AI chip packaging as core equipment unit misses

ASMPT's sales jumped 49% in Q3 mainly due to high demand for AI chip packaging, while its core semiconductor equipment business underperformed. The advanced packaging segment, especially thermo-compression bonding (TCB) used for stacking memory on AI chips, is now the fastest growing part of the AI hardware supply chain, with TSMC and major customers like Nvidia and AMD facing packaging capacity constraints through 2027.

This Wire brief sits within Fusion42's coverage of Semiconductors.