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Wire · technology

New Semiconductor R&D Hub Planned for Hokkaido by 2030

28 October 2026 · By · Wire by Fusion42

Published

28 October 2026

Topic

technology

◆ Sectors

Semiconductors

◆ Geography

Japan

◆ Source

Read at japan-forward.com →

◆ Verified

Fusion42 · 28 October 2026 · Fusion42 review

NTT Docomo Business, Mitsubishi Estate, and the city of Chitose plan to develop a semiconductor R&D hub near Rapidus's facilities in Hokkaido by 2030, focusing on chipmaking from fabrication to assembly and incorporating next-generation communications systems including IOWN to reduce power use.

This Wire brief sits within Fusion42's coverage of Semiconductors.

◆ ◆ The Wire takeaway

The opening of a new semiconductor hub in Hokkaido boosts Japan's chipmaking capacity and opens space for suppliers across the fabrication and assembly chain to engage with Rapidus and partners. You should explore partnerships tied to advanced network tech like IOWN to tap into emerging production efficiency gains.

◆ Coverage

1 source · 28 Oct 2026

◆ Related on Wire

◆ Topics

Semiconductorssemiconductorresearch-and-developmentjapanchipmakingcommunicationspower-efficiency