Samsung Elec wins $200 billion Broadcom AI chip partnership, boosting foundry push

Samsung Electronics secured a $200 billion partnership with Broadcom through 2030 covering memory chips, contract manufacturing, and advanced packaging, with Broadcom's next-generation communications chips to be made on Samsung's sub-2-nanometre process. The deal strengthens Samsung's foundry business against TSMC by locking in long-term AI chip production capacity from a major custom silicon designer.

This Wire brief sits within Fusion42's coverage of Semiconductors and AI Infrastructure, and 4 sources have reported it between 25 Jul 2026 and 31 Jul 2026.