Cadence rolls out AI agent to speed circuit board, chip packaging des…

Cadence Design Systems launched AuraStack, an AI agent that automates circuit board and chip package design using plain-language instructions, claiming time-to-market cuts of up to 50% and task productivity gains up to 15-fold. The tool integrates with Cadence's existing software, runs on Nvidia chips, and will be available by September 2026 with consumption-based pricing. If you sell anything into the chip or board design workflow—power management, simulation, signal integrity, thermal analysis—Cadence just automated away your customer's need to call you. You either get bought into AuraStack or you become the thing the AI learns to replace.