Wire · technology
TSMC to Have CoWoS Interposers Manufactured at GlobalFoundries
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Fusion42 · 10 October 2026 · Fusion42 review
TSMC has partnered with GlobalFoundries for a $2 billion, five-year agreement for manufacturing silicon interposers used in its CoWoS advanced AI packaging ecosystem at GlobalFoundries' fab in Malta, New York, starting volume production in H1 2028.
This Wire brief sits within Fusion42's coverage of Semiconductors, and 3 sources have reported it between 9 Oct 2026 and 10 Oct 2026.
◆ ◆ The Wire takeaway
The US foundry GlobalFoundries is now a key supplier of TSMC's critical AI chip packaging components. If you operate in semiconductor packaging or AI hardware supply, you have a new local manufacturing partner and potentially faster routes to scale your production for advanced AI accelerators.
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3 sources · first reported 9 Oct 2026 · latest 10 Oct 2026
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