Future of wireless systems: compact chip-based transceiver with ultra-low power consumption

Researchers at Institute of Science Tokyo have developed a compact 300-GHz-band 4×4 bidirectional phased-array transceiver in 65-nm CMOS with ultra-low power consumption (26 mW per element) and minimal chip area (0.30 mm²), representing the first fully integrated 2D terahertz array with on-chip antennas above 200 GHz. This breakthrough directly enables scalable, manufacturable 6G wireless systems by solving critical challenges in beam steering and power efficiency at terahertz frequencies.

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