New quantum material and chip architecture tackle a key barrier to scaling quantum ...

Researchers at Warwick and NRC Canada have demonstrated Quantum Phononic Links (QPLs), a new chip architecture using sound vibrations through engineered germanium-on-silicon material to enable long-range communication between qubits across a single semiconductor chip. The approach is compatible with existing semiconductor manufacturing and could offer a simpler, cheaper path to scaling quantum processors beyond current nearest-neighbour qubit connectivity limits.

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