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Chinese CXMT to Match Micron's DRAM Manufacturing Capacity This Year
Chinese memory maker CXMT is projected to match Micron's DRAM manufacturing capacity (350,000 wafers/month) by end-2026 despite US sanctions blocking access to advanced lithography tools, using older DUV technology and multi-patterning techniques. The company is also scaling production of DDR5 and LPDDR5X chips for AI workloads, with the Chinese government directing CXMT to share technology with other domestic manufacturers.
This Wire brief sits within Fusion42's coverage of Semiconductors and AI Infrastructure. Wire is Fusion42's founder-focused intelligence feed: each story is connected to the funds and startups it names — every one with a live profile on Raise or Scout — so founders can follow the capital and the momentum behind the headline rather than just the headline itself. Wire analysis is one of the live surfaces Arthur, Fusion42's AI co-founder, reasons over.
The Wire takeaway
If you're building AI systems that require DRAM, your supply chain just got a second source outside US control—and CXMT will ship at scale this year. That changes your negotiating power with Micron and Samsung, and it changes which geographies can buy from you.
Read the full story at techpowerup.com →
Topics: Semiconductors · AI Infrastructure · dram-capacity · us-sanctions-workaround · chip-supply-chain · ai-demand · semiconductor-decoupling