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Besançon-based Lightspring raises over €3.5 million to industrialise photonic chip packaging
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Fusion42 · 22 September 2026 · Fusion42 review
Lightspring, a French DeepTech startup, raised over €3.5 million including a €3.1 million Seed round and grants to industrialise photonic chip packaging by using 3D lithography to create reproducible optical interfaces, aiming to cut costs and boost scalability in AI infrastructure photonics.
This Wire brief sits within Fusion42's coverage of Photonics & Optics.
◆ ◆ The Wire takeaway
You gain a manufacturable method to slash photonic chip packaging costs and complexity, opening AI hardware markets previously blocked by expensive optical interfaces. This breakthrough demands you explore closer partnerships with Lightspring to incorporate faster, cheaper photonic coupling into your hardware designs.
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1 source · 22 Sep 2026
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