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LG PRI Reportedly Lands First Production-Line Order for Semiconductor Packaging LDI Tool
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Fusion42 · 22 August 2026 · Fusion42 review
LG Electronics Production Engineering Research Institute (LG PRI) reportedly received its first order for a laser direct imaging (LDI) tool intended for a semiconductor packaging production line from a global OSAT company. This marks LG PRI's progression from supplying R&D equipment to securing production-line deployment, although delivery, acceptance, and mass production qualification remain unreported.
This Wire brief sits within Fusion42's coverage of Semiconductors.
◆ ◆ The Wire takeaway
LG PRI has moved from academic supply to commercial production-line orders, signalling new competition in semiconductor packaging equipment. If you supply OSATs or package semiconductors, this opening means you should evaluate LG PRI as a potential equipment vendor.
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1 source · 22 Aug 2026
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