ISC Unveils Modular Test Socket for Ultra-Large Semiconductor Packages

ISC has launched WiDER-Max, a modular test socket supporting ultra-large semiconductor packages up to 180×120mm, targeting the growing AI chip market by accommodating larger, more integrated packages with complex architectures like chiplets, GPUs, CPUs, ASICs, and HBM.

This Wire brief sits within Fusion42's coverage of Semiconductors.