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Why Top Semiconductor Giants Are Flocking to CPO Technology

Published

1 September 2026

Topic

technology

Sectors

Semiconductors

Source

Read at eu.36kr.com

Verified

Fusion42 · 1 September 2026 · Fusion42 review

Leading semiconductor companies including NVIDIA, SK Hynix, AMD, TSMC, Samsung, GlobalFoundries, and Intel are accelerating development and commercialisation of Co-Packaged Optics (CPO) technology to overcome electrical interconnection limits in data centers, aiming for higher bandwidth and energy efficiency in AI workloads.

This Wire brief sits within Fusion42's coverage of Semiconductors.

◆ The Wire takeaway

You face a shift from copper to integrated optics that slashes power use and boosts data rates inside chips. Start testing or partnering on co-packaged optics now or risk falling behind in AI infrastructure demand.

Coverage

1 source · 1 Sep 2026

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Semiconductorssemiconductorco-packaged-opticsenergy-efficiencyai-data-centersoptical-interconnect