SMIC's 7nm win has strings attached

SMIC has achieved 7nm-class density on its N+3 process using multi-patterning and design tricks, demonstrated in Huawei's Kirin 9030, but the chip suffers severe power and performance penalties compared to TSMC and Apple's designs. The breakthrough in area density masks fundamental limitations in power efficiency, performance-per-watt, and manufacturing yield that widen as competitors move to 2nm.

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