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Wire · technology

NVIDIA could use Intel Foveros packaging in 2028: TSMC may still make the GPU dies

9 October 2026 · By · Wire by Fusion42

Published

9 October 2026

Topic

technology

◆ Sectors

SemiconductorsAI Infrastructure

◆ Geography

United States

◆ Source

Read at en.softonic.com →

◆ Verified

Fusion42 · 9 October 2026 · Fusion42 review

NVIDIA may adopt Intel's Foveros advanced packaging technology in 2028 to handle GPU assembly, while TSMC continues producing the main GPU dies, aiming to alleviate TSMC's packaging bottlenecks and diversify supply chains.

This Wire brief sits within Fusion42's coverage of Semiconductors and AI Infrastructure.

◆ ◆ The Wire takeaway

Chip makers using new packaging methods like Intel's Foveros could reshape GPU supply chains this year. You need to explore how your product design or partnerships can benefit from faster, denser chip integration.

◆ Coverage

1 source · 9 Oct 2026

◆ Related on Wire

◆ Topics

SemiconductorsAI Infrastructurenvidiaintelfoverostsmcchip-packaginggpu