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Wire · technology

Huawei to launch two new AI chips in 2027

17 September 2026 · By · Wire by Fusion42

Published

17 September 2026

Topic

technology

◆ Sectors

Semiconductors

◆ Geography

China

◆ Source

Read at gbcode.rthk.hk →

◆ Verified

Fusion42 · 17 September 2026 · Fusion42 review

Huawei will launch two new AI semiconductor chips, the 960DT and the Ascend 960PR, in 2027 while advancing their UnifiedBus technology to connect large numbers of AI chips into powerful computing systems.

This Wire brief sits within Fusion42's coverage of Semiconductors, and 9 sources have reported it between 17 Sep 2026 and 1 Oct 2026.

◆ ◆ The Wire takeaway

Huawei is building advanced AI compute platforms that scale by linking many chips, opening opportunities for suppliers and partners in chip connectivity and AI cluster management.

◆ Coverage

9 sources · first reported 17 Sep 2026 · latest 1 Oct 2026

◆ Related on Wire

◆ Topics

Semiconductorshuaweiai-chipssemiconductorsunifiedbuschina-tech